EOS recently introduced two new metal additive manufacturing (AM) materials: EOS NickelAlloy IN718 API and EOS Nickel NiCP -- both delivering excellent performance and part properties for EOS Laser Powder Bed Fusion (LBPF) 3D printing technology.
EOS Customer Part -- Small Area of a Flow Module IN718 API
EOS NickelAlloy IN718 API
EOS' NickelAlloy IN718 API is ideal for high-performance oil and gas applications with API 6ACRA standard requirements.
This nickel-based material combines high-impact toughness at low temperatures and excellent corrosion resistance for high-stress oil and gas applications.
With a tensile strength of 878 MPa and 27% elongation, when combined with a specific heat treatment, this material meets the requirements for API 6ACRA standardization, opening the door for oil and gas manufacturers to use AM for downhole, injection and fixture, and fastener applications, among others.
A leading inflow control technology organization provided an early test case for EOS NickelAlloy IN718 API, producing a flow module component meeting API standardization and high-strength performance while being subjected to the corrosive environment of oil and gas equipment.
Parts show good tensile, fatigue, creep and rupture strength at temperatures up to 700°C making the alloy ideal for many high temperature applications such as gas turbine and instrumentation parts.
"Additive manufacturing has previously been out of reach as a solution for demanding downhole applications due to the stringent requirements of the oil and gas industry. With the development of EOS NickelAlloy 718 API, we are now able to evaluate industrial 3D printing's business case for our manufacturing needs, while ensuring all facets of part performance remain unchanged," said an inflow control EOS customer.
EOS Nickel NiCP
EOS' Nickel NiCP is ideal for semiconductor and chemical applications requiring Nickel purity, corrosion resistance and ductility.
This material provides a tensile strength of 400 MPa and 49% elongation, making it an ideal candidate for applications like gas injectors and corrosion-resistant components within semiconductor capital equipment.
EOS Demo Part -- Gas Injector NiCP on EOS M 290
Traditionally manufactured applications in the semiconductor equipment industry often include electroless nickel plating to increase the corrosion resistance in chemically harsh conditions. Parts can now be manufactured entirely with EOS Nickel NiCP, eliminating the need for plating and thereby extending the life of the consumable.
"By additively manufacturing these parts, manufacturers can maximize machine uptime and availability, which in turn increases overall throughput of the wafer fabrication process and benefits the end user's revenue. Eliminating the electroplating process that generates hazardous waste offers a cleaner, more sustainable manufacturing process for the future," said Sophia Heyl, EOS Product Specialist.
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